Over the last two decades ATT Systems transformed from a start-up company to a mature, reliable business partner and technology leader focusing on the development of advanced thermal solutions for the semiconductor industry.
ATT innovate, develop and service advanced temperature test systems for the semiconductor industry.
ATT unique modular hybrid technology combines both, hot and cold systems as well as air- and liquid cooled chuck systems.
Applications & Solutions
Cold Upgrade –
• Cold Upgrade Solutions for various prober types – P8XL, P12XL, PrecioXL, UF2XXX, UF3XXX
• Onsite Sealing Upgrade within 7-10 working days
AddOn –
•Modular Stacks for various applications
•HV/HC (10KV/500A), LN, Plain, AddOn Technology Caro, warped substrates
Moveable Chiller –
• Chiller can be shared between several “cold ready” probers
• Self sealing couplings and automatic chiller detection
Dry Air Control –
• Advanced dry air control to purge with two individual media (e.g. CDA, N2)
• Copper pad protection against oxidation
• Adaptive Dew Point control to reduce CDA consumption
High Power/Accuracy –
• Low Thermal Resistance Chuck for High Accuracy Applications
• Absolute Uniformities of +/-0.2°C on 300mm wafers
• Heat dissipation of 2000W at -40°C
100 %
Quality
100 %
Reliability
100 %
Service
ATT Systems focuses on continuous improvement in quality, reliability, service, support and in the entire customer experience with our products and solutions.