Yield Improvement
Minimize false failures and reduce retest rates.
Gel-Probe Cleaning Sheet | Precision Probe Cleaning Technology
The Gel-Probe cleaning sheet is designed with a non-abrasive gel material, effectively removing residual particles and contaminants from probe tips. It is suitable for various types of probe cards (MEMS, Vertical, Cantilever).
With excellent elasticity and low contact force characteristics, the product enables effective cleaning without damaging the probes. It is widely used in wafer sort and parametric testing processes.
Gel-Probe Product Structure
Multi-layer Structure
The Gel-Probe cleaning sheet features a multi-layer structure design, balancing cleaning efficiency and mechanical stability.
Through optimized material configuration, it effectively reduces probe wear and contamination risks.
Suitable for high-precision semiconductor testing environments, ensuring long-term stable operation.
Through optimized material configuration, it effectively reduces probe wear and contamination risks.
Suitable for high-precision semiconductor testing environments, ensuring long-term stable operation.
Practical
Tech features
Cost Efficiency
Reduce probe card maintenance and replacement costs.
Test Stability
Improve stability in wafer sort and parametric testing processes.
Probe Cleaning Solution – FT / CP
This table outlines the differences in application conditions of Gel-Probe cleaning sheets between FT and CP processes, along with corresponding cleaning material specifications and selection parameters.
It covers key technical indicators such as brand and model configuration, material composition, particle size, structural design, thickness, and operating temperature range.
| 項目 | FT | CP |
| Brand | SCS | Gel-Pak |
| Model | MSI5105 / MSC1505 | ReFine / ReMove / ReCover |
| Application | 1. Pogo pin 2. Spring pin |
MEMS / Vertical Probe Card |
| Main Material | SiC | SiC |
| Size | 3–6 μm 💬 |
0.5–5 μm |
| Color | Grey | Grey |
| Type | Sand-coated metal foam | Sand-coated metal foam |
| Temperature Range | -40°C ~ 150°C | -60°C ~ 200°C 💬 |
| Cleaning Method | Contact (dabbing) | 沾Contact (dabbing) |
| Thickness | 0.25 ± 0.03 mm | 200 mm wafer：958 ± 30 μm Clean Sheet：385 ± 20 μm |
Gel-Pak is a U.S.-based manufacturer of precision component protection materials, specializing in gel materials and high-precision tooling applications.
With comprehensive capabilities from material design to product development, its products are widely used in semiconductor, optoelectronics, and high-tech industries, providing effective protection during manufacturing, handling, and transportation processes.
Driven by high quality and innovation, Gel-Pak leverages proprietary material technologies to deliver stable and reusable solutions.
It helps customers improve yield and operational efficiency while reducing contamination and damage risks, making it a key supplier in precision component protection and cleaning applications.
Precision Component Protection
Secures fragile components
Reduces damage risk
Reduces damage risk
Suitable for high-precision applications
Custom Carrier Solutions
Custom Carrier Solutions
Rapid response to customer needs
Rapid response to customer needs
Traceability support
Testing & Process Efficiency
Improves handling efficiency
Reduces yield loss risk
Reduces yield loss risk
Extends probe card lifespan
Contact us now to learn more about Gel-Probe cleaning sheet products, technical specifications, and application solutions.
We provide prompt and professional support to help optimize your testing efficiency.