Gel-Probe Cleaning Sheet
Gel-Probe Cleaning Sheet | Precision Probe Cleaning Technology
The Gel-Probe cleaning sheet is designed with a non-abrasive gel material, effectively removing residual particles and contaminants from probe tips. It is suitable for various types of probe cards (MEMS, Vertical, Cantilever).
With excellent elasticity and low contact force characteristics, the product enables effective cleaning without damaging the probes. It is widely used in wafer sort and parametric testing processes.
Gel-Probe Multi-layer Structure
Through optimized material configuration, it effectively reduces probe wear and contamination risks.
Suitable for high-precision semiconductor testing environments, ensuring long-term stable operation.
Probe Cleaning Solution – FT / CP
This table outlines the differences in application conditions of Gel-Probe cleaning sheets between FT and CP processes, along with corresponding cleaning material specifications and selection parameters.
It covers key technical indicators such as brand and model configuration, material composition, particle size, structural design, thickness, and operating temperature range.
| Item | FT | CP |
| Brand | SCS | Gel-Pak |
| Model | MSI5105 / MSC1505 | ReFine / ReMove / ReCover |
| Application | 1. Pogo pin 2. Spring pin | MEMS / Vertical Probe Card |
| Main Material | SiC | SiC |
| Particle Size | 3–6 μm 💬 | 0.5–5 μm |
| Color | Grey | Grey |
| Type | Foam-backed SiC abrasive gel | Foam-backed SiC abrasive gel |
| Temperature Range | -40°C ~ 150°C | -60°C ~ 200°C 💬 |
| Cleaning Method | Contact (dabbing) | Contact (dabbing) |
| Thickness | 0.25 ± 0.03 mm | 200 mm wafer：958 ± 30 μm Clean Sheet：385 ± 20 μm |